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Patent Searching and Data


Title:
THIN FILM FORMING METHOD
Document Type and Number:
Japanese Patent JPH0790584
Kind Code:
A
Abstract:

PURPOSE: To stably form a thin film uniform in thickness on a substrate by measuring the film thickness at the intermediate point of a thin film depositing zone and adjusting the final film thickness by feedback control.

CONSTITUTION: A substrate 41 is continuously transferred in a vapor deposition chamber 11, and the substrate 41 on which a thin film is formed is irradiated with the light from a light emitting element 21 consisting of the tip of an optical fiber, etc. The light is received by a light receiving element 13, and the transmittance is measured by a transmission type film thickness monitoring device 25. The measured thickness is compared with a reference value in a controller 31, and a final film thickness correcting plate 19 is opened or turned in the closing direction to change the distance of a film forming zone. Otherwise, the transfer speed of the substrate 41 or the vaporization rate of a thin film forming material from a vaporization source is controlled.


Inventors:
KIKUCHI KAZUO
MATSUMOTO SHIGEJI
ZAISHO SHINICHIRO
Application Number:
JP25943693A
Publication Date:
April 04, 1995
Filing Date:
September 22, 1993
Export Citation:
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Assignee:
SHINCRON KK
International Classes:
C23C14/54; (IPC1-7): C23C14/54
Attorney, Agent or Firm:
Fumio Usmura