Title:
SOLDERING METHOD AND ITS DEVICE
Document Type and Number:
Japanese Patent JPH0631438
Kind Code:
A
Abstract:
PURPOSE: To provide a soldering method and its device having good soldering efficiency.
CONSTITUTION: In the soldering method for executing the soldering to the fixed position in a material to be soldered by fusing and cutting a solder wire 4 by a solder wire fusing means, notches 10 are formed by a notch forming means in the interval having the length corresponding to this consumption. By this method, the solder can be built up to the soldering part in the good condition of bulky state and semi-spherical shape, and the soldering efficiency can be improved.
Inventors:
YAMADA ICHIRO
Application Number:
JP18715392A
Publication Date:
February 08, 1994
Filing Date:
July 14, 1992
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD
TANABE DENSHI SANGYO KK
TANABE DENSHI SANGYO KK
International Classes:
B23K3/00; B23K3/06; (IPC1-7): B23K3/06; B23K3/00
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
Next Patent: MARKING LINE TRACING TYPE CUTTING APPARATUS