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Title:
【発明の名称】アミド又はイミドを導入した新規の共重合体、その製造方法及びこれを含有するフォトレジスト
Document Type and Number:
Japanese Patent JP3107770
Kind Code:
B2
Abstract:
A novel copolymer useful for photoresist, which allows a formation of patterns showing a significantly improved resolution in a photolithography using ArF (193 nm) light source, is prepared by copolymerizing at least two cycloaliphatic olefins with an amide or imide.

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Inventors:
Chung Jaechang
Lu Chi-hyun
Application Number:
JP18133497A
Publication Date:
November 13, 2000
Filing Date:
July 07, 1997
Export Citation:
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Assignee:
Hyundai Electronics Industry Co., Ltd.
International Classes:
G03F7/038; C08F220/54; C08F222/40; C08F232/00; C08F232/04; C08F232/08; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; G03F7/038; H01L21/027
Domestic Patent References:
JP5297591A
JP10111569A
JP9230595A
JP1010739A
JP10130340A
JP10153864A
JP10207070A
JP10218947A
JP1217453A
Other References:
【文献】国際公開97/33198(WO,A1)
Attorney, Agent or Firm:
Yoshiki Hasegawa (4 outside)



 
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