Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BONDING METHOD
Document Type and Number:
Japanese Patent JPS587474
Kind Code:
A
Abstract:

PURPOSE: To prolong the potlife of an adhesive and obtain a sufficient open time, by treating the surface to be coated with a specific polyvalent metallic compound, applying a high polymeric adhesive composition containing carboxylic acid groups, etc. in the high polymeric chain, and bonding the surfaces to be bonded.

CONSTITUTION: The surfaces to be bonded are pretreated with a polyvalent metallic compound, e.g. magnesium oxide or aluminum chloride, of GroupsIW VIII in the periodic table, and a high polymeric adhesive composition containing carboxylic acid groups and/or acid anhydride groups in the high polymeric chain, preferably isobutylene-maleic anhydride copolymer, is applied thereto to carry out the bonding of the surfaces. A filler, e.g. wood meal or wheat flour, or PVA, phenolic resin, etc. may be added to the high polymeric adhesive composition.

USE: Preparation of veneers with precious wood.


Inventors:
AKAGANE KAZUO
YOSHIGA IKUO
AKITA YASUO
Application Number:
JP10463181A
Publication Date:
January 17, 1983
Filing Date:
July 03, 1981
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C09J5/00; C09J5/02; C09J11/04; (IPC1-7): C09J3/14; C09J5/02
Attorney, Agent or Firm:
Kimura Katsuya