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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS596247
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. having excellent flame retardance, heat resistance and electrical characteristics as well as excellent quick-curability, storage stability, etc., by incorporating Sb2O3, a filler and a silane coupling agent in a specified epoxymethacrylate resin compsn.

CONSTITUTION: A curable resin compsn. is obtd. by incorporating 1W10pts.wt. Sb2O3, 100W500pts.wt. filler such as powdered or fibrous filler (e.g. silica, rock wool or nylon) and 0.25W5pts.wt. silane coupling agent such as vinyltriethoxysilane in 100pts.wt. epoxymethacrylate resin compsn. obtd. by blending a brominated epoxymethacrylate resin with a novolak type epoxymethacrylate resin in such a proportion that the amount of bromine accounts for 5W30wt% of the total amount of the compsn. The resultant compsn. has excellent flame retardance, heat resistance and electrical characteristics as well as excellent quick-curability, storage stability, etc.


Inventors:
ICHIMURA SHIGEKI
KINASHI KEIICHI
KUBO ETSUJI
Application Number:
JP11646482A
Publication Date:
January 13, 1984
Filing Date:
July 05, 1982
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F299/00; C08F290/00; C08F299/02; C08G59/00; C08K3/22; C08K5/54; C08L63/00; C08L63/10; C08L67/00; C08L77/00; (IPC1-7): C08F299/02; C08K3/22; C08K5/54; C08L63/10
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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