Title:
STRUCTURE OF BONDING JUNCTION SECTION OF RESIN SEAL SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS6037136
Kind Code:
A
Abstract:
PURPOSE:To improve the reliability of a junction section by forming a wire cut section in a bonding section on the pellet side of an element on a pellet surface and joining a wire so that the cut surface forms an acute angle with respect to the pellet surface. CONSTITUTION:A tool 2 holding an aluminum bonding wire 1 is moved on a pellet 3, pulled up upward and inclined, and cut bonded on the pellet 3 by the end section 10 of the tool 2. Since there is the cut section 4 of the bonding wire on the pellet 3 and a clearance between the wire and the pellet is removed, a resin does not intrude into the tip section of the bonding wire after sealing the resin, and the reliability of a junction section can be improved.
Inventors:
NAGAO YUTAKA
Application Number:
JP14476783A
Publication Date:
February 26, 1985
Filing Date:
August 08, 1983
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/607; H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Shin Uchihara