PURPOSE: To reduce thermal strain applied to the end section of a solder layer, and to prevent the deformation and thermal fatigue breakdown of each member by forming a notch section or a recessed section to at least one of the fringe sections of the surfaces of a semiconductor base body and an insulating member and the surface section of a metallic member opposite to the fringe sections.
CONSTITUTION: A metallic support member 11 is formed by a copper plate, and the recessed section 28 of 3mm width × 0.5mm depth is formed to a section opposite to the fringe section of the insulating member 12 placed in the upper surface of the member 11. The insulating members 12 consisting of two alumina plates are bonded by the solder layers 29 while being conformed to the positions of the recessed sections 28 of the metallic support member 11, and metallic plates 13 are bonded on each insulating member 12 by the solder layers 30. Sections opposite to the solder layers 29, 30 of the insulating members 12 are metallized. The metallic plate 13 is formed by a copper plate in 2mm thickness, and the notch section 31 of 3mm width × 0.5mm depth is formed to the fringe section of the lower surface of the plate 13 and the recessed sections 28 of 1.5mm width ×0.5mm depth to sections opposite to the fringe sections of semiconductor base bodies 14, 15, 16 placed on the upper surface of the plate 13 by a press.
MINAGAWA TADASHI
OOGAMI MICHIO
WAKUI TAKAYUKI
YATSUNO KOUMEI
| JPS5662343A | 1981-05-28 | |||
| JP50041465B |