PURPOSE: To cut a lead frame without changing the shape of the leads of an IC by constituting metal dies for pressing of a tray for the lead frame wherein plural number of IC tips are fixed in a specified interval, a lower die holder below the tray and an upper die holder above the tray and moving the tray by a center pin and a pilot pin installed on a lower die and an upper die respectively.

CONSTITUTION: On a lower die holder 2, a die 11 is projected through a die plate 12 and a guide plate 4 is attached surrounding the die 11. On the guide plate 14, a tray 13 which houses a lead frame 17 on which plural number of IC tips 15 are fixed in a specified interval is loaded and above the tray 13, an upper die is positioned. Under the upper die 1, a packing plate 10, a punch plate 4 and a stopper plate 8 are provided and penetrating these, a punch 3, a knock-out pin 5 and a pilot pin 19 are formed. The pin 19 is pressed downwards using a spring 6. Simultaneously, a center pin installed on the die 11 but is not shown in the diagram comes out and comes in and the tray 17 is moved.