PURPOSE: To provide a film carrier capable of manufacturing a semiconductor device at high speed without damaging a board which mounts semiconductor components, and what is more, without increasing the size of the device as well.

CONSTITUTION: This is a film carrier 15 which comprises a flexible base film 2 to which a device hole 3 is installed and an inner lead wire 16a which is protrusively installed in the device hole 3 and an outer lead wire 16b which is installed continuously with the inner lead wire, and what is more, which is extended outside the device hole 3. The outer lead wire 16b comprises a first outer lead wire A which is formed in a larger width than the inner lead wire 16a and bent when it is mounted and a second outer lead wire B which is formed in a smaller width than the first outer lead A and pressed with a bonding tool when it is mounted.