CHIP CARRIER MODULE AND ITS PRODUCTION

Japanese Patent JPH0831995

A

PURPOSE: To provide a method of realizing a high density element by improved reliability and increased power consumption by improving radiation efficiency from a flip chip. CONSTITUTION: A heatsink 118 of A1 or copper is mounted on a ceramic cap 100 or on an exposure semiconductor chip 102 by using flexible epoxi 120 so as to improve radiation efficiency. The A1 is covered either with an anode oxide film or chrominium acid salt conversion and copper is covered with nickel. Such a structure is useful for mounting of a flip-chip on a flexible or hard organic material circuit substrate and for formation of a chip carrier package of CQFP, CBGA or others. These adhesives bear a heat cycle test of 300 times at -40 deg.C to 140 deg.C and having no strength drop in spite of continuous exposure of 1000 hours at 130 deg.C. Epoxy has an elasticity coefficient of less than 10<5> psi and a glass transfer point of less 25 deg.C being very strong and not contaminating the module and the substrate and having a thermal expansion coefficient between a die and a radiator metal.

TOOMASU MORAN KARUNEEN
MAIKERU ANSONII GEINZU
PINGU UONGU SETO
HASAIN SHIYAUKATSURUA

JP15137695A

February 02, 1996

June 19, 1995

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IBM

H01L21/56; H01L23/40; H01L23/31; H01L23/36; H01L23/367; H01L23/373; H01L23/42; (IPC1-7): H01L23/40

Kiyoshi Goda (2 outside)

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