PURPOSE: To efficiently dissipate heat in a semiconductor device to be in a simple structure by a method wherein the surface of the semiconductor device is covered with a heat dissipating solid or jelly heat conductive insulator to be entirely molded with resin.
CONSTITUTION: A circuit part 2 is formed on a semiconductor substrate 1 to provide a heat dissipating solid or jelly heat conductive insulator 3 on the surface of the circuit part 2. Next, the whole part is molded in an insulating resin 8. Thus, the heat generated by power transistors is transmitted to another transistor through the heat conductive insulator 3. At this time, the heat conductive insulator 3 is formed by evaporation in sufficient thickness so that the heat generated in the semiconductor device may be sufficiently dissipated. Accordingly, even if the differential pair transistors are formed, both thermal and electrical characteristic unbalance can be avoided.
OTANI KENJI
INOUE KOICHI
NAGANUMA KEISUKE
FURUNO TOMOMI
