Title:
MANUFACTURE OF PHOTOSENSITIVE TRANSFER MATERIAL AND PHOTORE-SIST STENCIL
Document Type and Number:
Japanese Patent JPS5975245
Kind Code:
A
Abstract:
The present invention relates to a photosensitive transfer material, which comprises a flexible temporary support film which is preferably transparent, a thermoplastic photosensitive layer, optionally a flexible cover film on the free side of the photosensitive layer and, optionally, an intermediate layer between the support film and the photosensitive layer. The photosensitive transfer material is suitable for manufacturing photoresist stencils and solder masks. The temporary support film has a rough surface which exerts an embossing effect on the surface of the photosensitive layer and the intermediate layer, respectively. The mat-finish of the intermediate layer prevents an irregular deformation of this layer in moist air, while the mat-finish of the photosensitive layer precludes unwanted reflections.
Inventors:
URURITSUHI GAISURAA
BUARUTAA HERUBUIHI
HERUGA JIKORA
BUARUTAA HERUBUIHI
HERUGA JIKORA
Application Number:
JP16853383A
Publication Date:
April 27, 1984
Filing Date:
September 14, 1983
Export Citation:
Assignee:
HOECHST AG
International Classes:
G03C1/76; G03C1/805; G03F7/004; G03C11/12; G03F7/09; G03F7/115; G03F7/34; (IPC1-7): G03C1/76; G03C5/24
Domestic Patent References:
JPS5019961A | 1975-03-03 | |||
JPS4999021A | 1974-09-19 | |||
JPS5642629A | 1981-04-20 |
Attorney, Agent or Firm:
Toshio Yano
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