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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS5966445
Kind Code:
A
Abstract:

PURPOSE: To composition that is produced by adding a polycarbonate resin to an AES resin made through a suspension polymerization process using a specific dispersant, thus showing high mechanical strength, weather resistance and processability and having improved deformation in its plastic deformation range and improved weld strength.

CONSTITUTION: The objective composition is obtained by combining (A) 10W 90wt% of an AES resin which is produced by polymerizing a finely crushed ethylene-propylene rubber, aromatic vinyl compounds, vinyl cyanides and/or alkyl esters of unsaturated carboxylic acids in the presence of dispersants selected from cellulosic compounds, acrylic acid compounds, inorganic salts and polyalkylene oxides and (B) 90W10wt% of a polycarbonate resin. The AES resin is a binary copolymer with a molar ratio of 5/1W1/3 ethylene/propylene or a terpolymer containing a non-conjugated diene in an amount of 2W50, when it is calculated with the iodine value.


Inventors:
SAKANO HAJIME
ITOU AKITOSHI
YANO GENICHI
HONDA YASUHIRO
FUJIWARA TAKAYOSHI
Application Number:
JP17776382A
Publication Date:
April 14, 1984
Filing Date:
October 08, 1982
Export Citation:
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Assignee:
SUMITOMO NAUGATUCK
International Classes:
C08F2/00; C08F2/18; C08F255/00; C08F255/02; C08F255/04; C08L51/00; C08L51/06; C08L69/00; (IPC1-7): C08F2/18; C08F255/02; C08L51/06; C08L69/00
Domestic Patent References:
JPS4848547A1973-07-10
JPS50109247A1975-08-28