Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6034038
Kind Code:
A
Abstract:
PURPOSE:To obtain the multilayer wirings having the flat surface of a semiconductor device by a method wherein a first insulating film is adhered on the surface of a semiconductor substrate, an underlayer wiring having the prescribed shape is formed thereon, the whole surface containing the wiring thereof is covered with a second insulating film, a photo resist film is provided on the protruding second insulating film adhered on the underlayer wiring, a third insulating is adhered using the resist film thereof as a mask to bury the protruding second insulating film, the mask is removed together with the third insulating film adhered thereon to flatten the surface, and an upperlayer wiring is adhered thereon. CONSTITUTION:A first insulating film 2 is adhered on a semi-insulating substrate 1, an underlayer wiring 4 having the prescribed shape is provided thereon, and a second insulating film 3 is adhered on the whole surface. Then the upper part of the film 3 positioning on the wiring 4 is covered with a photo resist film 6, and a third insulating film 7 is adhered using the resist film thereof as a mask to bury the recess between the wiring 4. After then, the film 6 is removed together with the film 7 adhered thereon, and an upperlayer wiring 5 is adhered on the flat surface consisting of the remaining films 3, 7. Accordingly, disconnection of the wiring 5 can be completely eliminated.
Inventors:
FUJITA MITSUOKI
Application Number:
JP14290583A
Publication Date:
February 21, 1985
Filing Date:
August 04, 1983
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/3205; (IPC1-7): H01L21/88
Attorney, Agent or Firm:
Uchihara Shin
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