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Title:
SEMICONDUCTOR DEVICE AND LEAD FRAME FOR USE IN MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04132248
Kind Code:
A
Abstract:

PURPOSE: To prevent an inner lead, tab, and tab lead from being entangled with one another by installing lead enter protective pieces in at least one of tab hanging lead and adjacent inner lead so as to butt to one another.

CONSTITUTION: In each unit lead frame 2, a pair of tab hanging leads 5 and 5 are laid out monolithically in nearly the central portion of both outer lead frames 3 and 3 so as to be perpendicular to outer lead frames 3 and to butt to each other, and between both tab hanging leads 5 a tab 6 formed into a nearly rectangular flat shape is laid out linearly and suspended monolithically. In the middle of both tab hanging leads 5 and 5, bent sections 5a and 5a are formed to be bent, and by these bent section 5a and 5a the tab 6 is lowered by a depth equal to the thickness of pellet in the direction of thickness. Further, in inner section 9a of each lead 9 a lead enter protective piece 8 is installed at a position closer to outer frame 3 than bent section 5a of tab hanging lead 5 so as to butt to the bent section 5a, and it is designed so that the distance D between the lead enter protective piece 8 and the tab hanging lead 5 be narrower than width W of tab hanging lead 5.


Inventors:
SATO YUKIHIRO
SHIMIZU KAZUO
Application Number:
JP25197790A
Publication Date:
May 06, 1992
Filing Date:
September 25, 1990
Export Citation:
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Assignee:
HITACHI LTD
HITACHI TOBU SEMICONDUCTOR LTD
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)



 
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