PURPOSE: To connect semiconductor elements directly to a wiring board securely and stably without using solder by pressing the semiconductor elements against the wiring board formed by forming a semiconductor pattern on an elastic insulator plate.

CONSTITUTION: The specific conductor pattern 12 is adhered to the elastic insulator plate 11 like a rubber plate by vapor deposition, etc., to form the wiring board 10, which IC chips 13 is arranged by positioning the electrode parts at the conductor pattern 12. In this state, support plates 14 and 15 made of relatively hard plates, i.e. metallic plate or hard plastic plates arranged on the reverse side of the wiring board and over the IC chips 13 are clamped with screws 16 to fix the wiring board 10 and IC chip 13, and the electrode part of the IC chip 13 is pressed against the conductor pattern 12 to connect IC chips 13 mutually. Further, the IC chips and batteries may be supported while sandwiched between both top and reverse surfaces while using the wiring board to cover the IC card.