PURPOSE: To form a noble metal plating layer having good close adhesiveness, by applying the dry plating of nickel onto titanium or a titanium alloy subjected to ion plating, and further applying the wet plating of a noble metal such as gold onto the plated one before baking.

CONSTITUTION: Ti or a Ti-alloy such as TiN is applied to a substrate such as stainless steel by ion plating and, thereafter, one metal selected from Ni, Pd, Au and Ag is plated in a film thickness of about 1,000W2,000 according to a dry plating method such as ion plating. Subsequently, one or more of Au, Pt, Rh, Pd or Ag or an alloy thereof is plated onto the metal plating film according to a wet plating method such as electroplating. In the next step, this metal plating film is baked at 200W700°C for 1W2min to perform the thermal diffusion of the dry plating layer and the wet plating layer and a noble metal plating film good in close adhesiveness and excellent in corrosion resistance is obtained.