EXPANDING DEVICE OF WAFER - MATSUSHITA ELECTRIC WORKS LTD

Title:

EXPANDING DEVICE OF WAFER

Document Type and Number:

Japanese Patent JPS5922339

Kind Code:

A

Abstract:

PURPOSE:To enable to obtain easily size of the outside diameter of an expanded wafer and the expanding rate of the wafer at the expanding process of the semiconductor wafer by a method wherein scales are arranged to an expanding stage toward four directions from the center. CONSTITUTION:The scales 8 extending to four directions from the center are adhered to the upper face of the expanding stage 3. Moreover a ring type scale 7 centering at the center of the expanding face is adhered to the circumference of an expanding film 2. The wafer 1 finished with dicing is adhered on the expanding film 2. The wafer 1 adhered to the expanding film 2 thereof is fixed to an expanding ring 9 to be put on the expanding stage 3, the expanding ring 9 is engaged with the circumference of the expanding stage 3, and the wafer 1 is expanded toward all directions. When the expanding film 2 is expanded toward all directions on the stage 3, size of the outside diameter of the wafer 1 can be measured according to the displaced position in relation to the scales 8 on the outside circumference of the wafer 1. Moreover by comparing the displaced position of the outside circumference of the wafer 1, or the scale 7 adhered to the circumference of the expanding film 2 in relation to the scales 8, the expanding rate is obtained.

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Inventors:

TAKAMI SHIGENARI
YAMAGUCHI TOSHIYUKI

Application Number:

JP13235282A

Publication Date:

February 04, 1984

Filing Date:

July 28, 1982

Export Citation:

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