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Title:
INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS596563
Kind Code:
A
Abstract:

PURPOSE: To contrive to simplify the mount of pellets and bonding after contriving the low impedance of power source terminals by a method wherein the frame for a power source electrode is provided inside an internal electrode.

CONSTITUTION: An island 2 whereon the pellet 1 is mounted and the frame 7 provided inside the internal electrode 5 are in conduction state. Since the island usually becomes at the minimum potential, the internal electrode 5 becomes the power source terminal for the minimum potential. Bonding is enabled from any part of the pellet to the frame, the impedance can be decreased by increasing the number of bonding pieces. A power source terminal of low impedance equal to that by a method wherein bonding is performed between the upper part of the pellet and the island as a conventional example can be obtained, and the pellet can be mounted at the center of the island because of unnecessity of preparing a bonding area on the island, resulting in the facilitation of the mount positioning. Further, height differences of bonding disappear, and the bonding by an auto bonder is enabled. The bonding between the internal electrode for signal purpose and the pellet is performed over the frame.


Inventors:
SATOU FUMIHIKO
KIMURA HIROMICHI
Application Number:
JP11653182A
Publication Date:
January 13, 1984
Filing Date:
July 05, 1982
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/12; H01L23/498; (IPC1-7): H01L23/12
Domestic Patent References:
JPS57107059A1982-07-03
Attorney, Agent or Firm:
Uchihara Shin



 
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