PURPOSE: To eliminate the dispersion of cooling for semiconductor elements, to upgrade the stability and the reliability of the elements and to efficiently cool the semiconductor elements by a method wherein a cooling plate is provided in contact to heat dissipating fins of the semiconductor elements mounted on a circuit substrate and the semiconductor elements are cooled by the cooling plate, and at the same time, are cooled by sending a cooling air in the heat dissipating fins, as well.
CONSTITUTION: A cooling plate 25 is provided with heat dissipating fins 22 through a compound 24 consisting of a substance such as silicone grease, etc., having high thermal conductivity. Elements 21 are cooled by the cooling plate 25, wherein a cooling liquid such as water, etc., has been flowed, through the compound 24 and the heat dissipating fins 22. Furthermore, the semiconductor elements 21 are cooled with a cooling air sent in the heat dissipating fins 22, as well. By such a method, the variation of junction temperature of the semiconductor elements due to the dispersion of thickness of the compound can be suppressed less.
YAMAMOTO HARUHIKO
UDAGAWA YOSHIAKI
OKADA TSUGIO
| JPS6131624A | 1986-02-14 |