Title:
WRITABLE INTEGRATED CIRCUIT PACKAGE
Document Type and Number:
Japanese Patent JPS6066835
Kind Code:
A
Abstract:
PURPOSE: To improve the efficiency of various works by enabling to described an identifying circuit for various circuits readly by a writing instrument used normally on the surface of an IC package.
CONSTITUTION: A pale sheet of suitable area or rough surface plastic sheet is bounded at the prescribed position on the surface of an IC package. Thus, prescribed symbols can be described by a pencil on this portion, thereby largely improving the efficiency of various works such as maintenance or tests.
Inventors:
ANDOU ICHIROU
Application Number:
JP17584683A
Publication Date:
April 17, 1985
Filing Date:
September 22, 1983
Export Citation:
Assignee:
TOYO COMMUNICATION EQUIP
International Classes:
H01L23/00; H01L23/544; (IPC1-7): H01L23/00
Domestic Patent References:
| JP55117847B | ||||
| JP57113445B | ||||
| JP54136531B |