PURPOSE: To reduce defects generated in the case of resin molding by forming an opening between lead groups of parts to be resin-sealed.
CONSTITUTION: In a tape carrier in which lead groups 40a-40d of many leads 4 are led in a plurality of directions and a chip 6 to be connected to the leads 4 is resin-sealed, an opening 14 is formed between the groups 40a and 40b of a part to be resin-sealed. For example, four punched parts 10 and one opening 14 are formed in a resin sealing region of a film tape 2, and the opening 14 is formed between the groups 40a and 40b placed at positions far from resin supply port (pot) 34 of a resin mold. Thus, when a chip is resin-sealed, resin flow rates of a resin pouring chamber of an upper mold and a resin pouring chamber of a lower mold can be balanced to reduce defects of resin-molded products.
KAMIYAMA TADASHI
OSADA MICHIO
TOWA KK
| JPH0434958A | 1992-02-05 |