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Title:
BONDABLE FILM
Document Type and Number:
Japanese Patent JPS6035073
Kind Code:
A
Abstract:

PURPOSE: To provide a bondable film capable of bonding a decorative metallic sheet to a thin body made of a resin with good workability without causing warpage, by providing a specified adhesive layer on one side of a plastic film and subjecting the other side to a release treatment.

CONSTITUTION: An adhesive consisting of 100pts.wt. acrylic polymer (e.g. a butyl acrylate/ethylhexyl acrylate/methacrylic acid copolymer), 20W80pts.wt. tackifier having a softening point of 100°C or above, such as Escolet #1315 (a product of Exxon Chemical Company) and not more than 30pts.wt. tackifier having a softening point of 70°C or below, such as YS resin #500 (a product of Yasuhara Sangyo k.k.). is used. A layer (0.03W0.15mm in thickness) of said adhesive is provided on one side of a plastic film such as a polypropylene film of 0.02W0.15mm in thickness and the other side is subjected to a release treatment comprising applying a silicone resin parting agent.


Inventors:
YAMAMOTO KAZUNORI
TAKAHASHI SHIYUUICHI
Application Number:
JP14349783A
Publication Date:
February 22, 1985
Filing Date:
August 04, 1983
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO
International Classes:
C09J7/02; (IPC1-7): C09J7/02
Domestic Patent References:
JPS5660744U1981-05-23
Attorney, Agent or Firm:
Shimizu Minoru



 
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