Title:
STRUCTURE OF MULTILAYER WIRING
Document Type and Number:
Japanese Patent JPS58192349
Kind Code:
A
Abstract:
PURPOSE:To attain low-resistance connection easily in the through-hole section of lower-layer wiring by forming a nonoxidizable conductor only to the through- hole section. CONSTITUTION:An island layer 11 made of nonoxidizable Au is formed onto the lower-layer wiring 16, in which Ni 12 is superposed onto Al 13, while being positioned to the throuh-hole of an insulating layer 10, and Al wiring 9 as an upper layer is formed. When the Au island layer 11 is formed, and coated with a resist film 21, the generation of a local battery is prevented, a Ni barrier layer 23 and an Al layer 24 are etched and wiring is formed at that time, the Al layer 24 can be processed without under-etching. According to the constitution, upper and lower metallic wiring can be connected without reducing the section of Al wiring and at low resistance through the through-hole of a minute area.
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Inventors:
YANADA SHIYUUJI
Application Number:
JP7591182A
Publication Date:
November 09, 1983
Filing Date:
May 06, 1982
Export Citation:
Assignee:
CITIZEN WATCH CO LTD
International Classes:
H01L21/768; (IPC1-7): H01L21/88