Title:
HYBRID INTEGRATED CIRCUIT SUBSTRATE
Document Type and Number:
Japanese Patent JPS58157147
Kind Code:
A
Abstract:
PURPOSE:To enable to mount a number of flip chips in high density, with high yield rate and high reliability by a method wherein an aperture is provided on a photosensitive film, and a solder ball is arranged in a concavity and an aperture part. CONSTITUTION:A concavity 10a, which was provided using a laser method and the like, an electrode conductor 20 formed using the prescribed pattern, and an insulating dam 30 to be used to prevent the flow of a solder ball 4 are provided on an insulating substrate 10. Also, an aperture 30a is provided on the photosensitive film, consisting of resin such as polyimide and the like, at the position corresponding to the concavity 10a using photolighographical technique and the like. An electrode conductor 20 is formed using a thick film technique, a photolithographic technique and the like.
Inventors:
HIDA TOSHIO
Application Number:
JP3990582A
Publication Date:
September 19, 1983
Filing Date:
March 12, 1982
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/34; H01L21/60; H05K1/09; H05K3/40; (IPC1-7): H05K1/18
Attorney, Agent or Firm:
Masuo Oiwa