PURPOSE: To obtain a module of high quality with excellent workability by bonding an insulating substrate on a radiator plate, bonding a frame of structure, in which a tie bar projects from the radiator plate, on the insulating substrate and removing the tie bar from the frame when manufacturing the semiconductor module.

CONSTITUTION: Ceramic substrates 21 are soldered on a Cu base plate 11 as a radiator plate, and a Cu frame 31 to which anode electrodes 31a and 31b, cathode electrodes 31c, 31d and 31e and gate electrodes 31f and 31g are mounted is soldered on the substrates. The frame 31 is constituted previously so that tie bars 31h in the frame 31 are projected to the outside of the base plate 11 at that time, semiconductor elements are mounted to each electrode, and the tie bars 31h are cut and removed. Accordingly, the application of abnormal stress to the frame 31 is prevented when the tie bars 31h are cut by nippers, etc., and workability is improved.