Title:
METHOD OF FORMING PATTERN
Document Type and Number:
Japanese Patent JPS58118115
Kind Code:
A
Abstract:
PURPOSE:To make possbiel reproducible scientific precision etching by a method wherein, with a conductive layer of a substrate as one of the poles and with a conductive substance whose material is different from the conductive layer as the other pole, the substrate is soaked in etching liquid and the current flowing from one to the other pole is measured. CONSTITUTION:Al is deposited on a substrate 2 through evaporation and a photoresist pattern is formed thereon. Then etching liquid 8 is used to selectively remove the exposed Al section. A platinum wire 4 enclosed by a concave rubber is made to contact the Al section on the substrate 2 to monitor the progress of the etching and used as one of the poles and then connected to a resistor 6, before being put in the liquid 8. Due to the battery action, current flows through the resistor 6, with a platinum wire 5 and the substrate 2 as positive and nagative poles, respectively. The voltage generated by the current flowing through the resistor 6 is amplified 10, converted into a digital signal by an A/D converter 12, inputted to a processor 13 and then stored in a memory 14. The processor 13 samples the current flowing acoross the substrate 2 and the platinum wire at predetermined time intervals and retrieves the current previously sampled from the memory 14 to compare the both values and determines that the end of the etching is approaching when the variation of the current becomes maximum.
Inventors:
KANDA KUNIHIKO
Application Number:
JP3782A
Publication Date:
July 14, 1983
Filing Date:
January 05, 1982
Export Citation:
Assignee:
SIGMA GIJUTSU KOGYO
International Classes:
H01L21/306; (IPC1-7): H01L21/306