Title:
COPPER ALLOY SOLDER
Document Type and Number:
Japanese Patent JPS609596
Kind Code:
A
Abstract:
Copper alloy solders are disclosed which contain 0.5 to 20% by weight of cobalt. The copper and cobalt may be arranged in heterogeneous phases.
Inventors:
PEETAA RISUTEMAN
ZUGAADO MENHI
ZUGAADO MENHI
Application Number:
JP11677184A
Publication Date:
January 18, 1985
Filing Date:
June 08, 1984
Export Citation:
Assignee:
HILTI AG
International Classes:
C22C9/00; B23K35/30; (IPC1-7): B23K35/30; C22C9/06
Attorney, Agent or Firm:
Akihide Sugimura
Next Patent: COATED TUNGSTEN ELECTRODE ROD