Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5984451
Kind Code:
A
Abstract:
PURPOSE: To smooth the insertion into a socket by a method wherein the lead part of a pin of a dual inline type package from the base to the tip is formed in wedge form having a continuous and gentle taper, and the tip is flattened.
CONSTITUTION: In the shape of the pin in a dual inline type package DIP, the lead part 12 from the base 11 to the tip is formed in the gentle wedge form, and the tip is flatted. Formation in such a pin form makes the insertion into the socket smooth and the strength large. Since the tip is flat, the danger of injury becomes less.
Inventors:
SHIRATORI KATSUO
Application Number:
JP19438182A
Publication Date:
May 16, 1984
Filing Date:
November 05, 1982
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L23/50; H01L23/495; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Takehiko Suzue