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Patent Searching and Data


Title:
COMPOSITION FOR ADHESION MEDIUM
Document Type and Number:
Japanese Patent JPS5815552
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. producing molding products with a smooth surface and a high adhesive power to hydrophilic material and substrate, prepared by adding a diene rubber to a thermoplastic styrene/diene block copolymer.

CONSTITUTION: 3W30pts.wt. diene rubber is added to 100pts.wt. thermoplastic styrene/diene block copolymer. The dienes are e.g., butadiene and isoprene. The diene rubber includes styrene/butadiene, polyisoprene, natural and acrylonitrile/ butadiene rubbers. When the diene rubber content is less than 3pts.wt., the compsn. shows poor adhesion to hydrophilic material and when it exceeds 30pts.wt., a molding product shows severe plastic deformation and is no longer suitable for practical use. Molding products formed from the compsn. have low-level cold flow and swelling and consequently good dimentional stability and can be bonded readily and strongly to paper, cloth, wood and other hydrophilic materials with a water-soluble adhesive.


Inventors:
KIDA YOSHIHIRO
OOSHIRO MASAO
Application Number:
JP11413381A
Publication Date:
January 28, 1983
Filing Date:
July 21, 1981
Export Citation:
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Assignee:
NIPPON ZEON CO
SANKYO KASEI KK
International Classes:
C08L53/00; B32B7/12; C08L7/00; C08L21/00; C08L23/00; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L53/02; C08L77/00; C08L101/00; C09J121/00; C09J153/00; (IPC1-7): B32B7/12; C08L53/02
Domestic Patent References:
JPS51121045A1976-10-22
JPS52140544A1977-11-24