Title:
FORMING METHOD OF MINUTE PATTERN
Document Type and Number:
Japanese Patent JPS59155931
Kind Code:
A
Abstract:
PURPOSE:To obtain a minute pattern of high accuracy even in a substrate having a stepped difference by preparing a plurality of masks in one process in exposure processes and using predetermined masks in response to the film thickness of a photosensitive material applied while changing the quantity of exposure. CONSTITUTION:When minute patterns are formed to a substrate 1 with a stepped difference, a photosensitive material 2 is applied on one surface of the substrate 1, and exposed and developed, and the substrate 1 is etched to obtain the desired patterns. However, there are a thick section and a thin section in the photosensitive material 2 applied, and the desired patterns are not acquired. Consequently, a plurality of masks of different thickness are prepared in exposure processes, and the masks are used selectively in response to the thickness of the photosensitive material 2 while the quantity of exposure to the photosensitive material 2 is also adjusted. Accordingly, the desired minute patterns are acquired after development.
Inventors:
NAKAJIMA MASAYUKI
MIYAKE KUNIAKI
OOGA HIROTOMO
TAKAYAMA KENJI
ITAKURA HIDEAKI
HATANAKA MASAHIRO
MIYAKE KUNIAKI
OOGA HIROTOMO
TAKAYAMA KENJI
ITAKURA HIDEAKI
HATANAKA MASAHIRO
Application Number:
JP3121483A
Publication Date:
September 05, 1984
Filing Date:
February 25, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G03F7/20; H01L21/027; H01L21/30; (IPC1-7): G03F7/20
Attorney, Agent or Firm:
Shinichi Kusano