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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS60103345
Kind Code:
A
Abstract:

PURPOSE: To obtain an image forming photosensitive resin compsn. superior in storage stability, hardenability, heat resistance of a film, etc., by mixing a photopolymerizable unsatd. compd. having plural terminal ethylenic groups, a photopolymerization sensitizer, and a specified linear polymer compd.

CONSTITUTION: An objective photosensitive resin compsn. is obtained by mixing (A) a photopolymerizable unsatd. compd. having plural terminal ethylenic groups, e.g., triethylene glycol acrylate, (B) a photopolymn. sensitizer, e.g., benzophenone, (C) a linear prepolymer obtained by polymerizing a compd. represented by formula I in which R1 is H, methyl, ethyl, or halogen, and R2, R3, R4 are each aliphatic or aromatic hydrocarbon group or the like, e.g., 1,1-dimethyl-1-(2-hydroxy-3-butoxypropyl)amine-methacylimide with a polymerizable compd. having an epoxy group, e.g., glycidyl acrylate.


Inventors:
YANAGISAWA KUNIO
ARAKI YASUHIKO
SHIYOUHI HAJIME
Application Number:
JP21226083A
Publication Date:
June 07, 1985
Filing Date:
November 10, 1983
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
G03F7/027; G03F7/004; G03F7/032; G03F7/033; G03F7/038; (IPC1-7): G03C1/68; G03F7/10
Domestic Patent References:
JPS5243092A1977-04-04
JPS509035A1975-01-30
JPS5550050A1980-04-11



 
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