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Patent Searching and Data


Title:
THICKNESS AND WARP MEASURING DEVICE OF PLATE-SHAPED OBJECT
Document Type and Number:
Japanese Patent JPS6095301
Kind Code:
A
Abstract:

PURPOSE: To make a titled device small-sized and inexpensive by providing a table which can move up and down, upper and lower measuring instruments for outputting a displacement of a thickness and a warp as an electric signal, a carrying device for carrying an object to be measured to a measuring position, and a driving device for lifting the lower measuring instrument.

CONSTITUTION: When a wafer 2 carried from the previous process by a round belt 14 contacts to a stopper pin 15, the belt 14 is stopped by a detection of a wafer detector (omitted in the figure). Also, a table 5 is lifted by a carrying device 26 consistng of a motor 18, a cam 19, a cam follower 20, and a slide plate 21, and a warp is measured by making an upper measuring instrument 8-1 contact to the wafer 2. Moreover, a lower measuring instrument 8-2 is lifted by a driving device 22 consisting of a holder 23, a slide plate 24 and a cylinder 25, and a thickness is measured by placing the wafer 2 between both the measuring instruments 8-1, 2.


Inventors:
TAMAI KOUICHI
Application Number:
JP20256383A
Publication Date:
May 28, 1985
Filing Date:
October 31, 1983
Export Citation:
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Assignee:
TOSHIBA KK
International Classes:
G01B5/20; G01B5/213; G01B21/20; (IPC1-7): G01B21/20
Domestic Patent References:
JPS53105261A1978-09-13
Attorney, Agent or Firm:
Noriyuki Noriyuki