PURPOSE: To contrive to achieve the speedup and efficiency increase of vacuum, vapor deposition process, by introducing preliminary evaporation process of the same deposition material in that exhaust process by using a conventional apparatus for vacuum vapor deposition.
CONSTITUTION: The evaporation source 3 loaded with deposition material 2 and the substrate 4 to be deposited are stored in the vacuum chamber 1 and the pressure inside the vacuum chamber is reduced to more than one third the required ultimate obtainable vacuum degree of preset value, for example, 2×10-6 Torr with an exhaust system. Then, it is exhausted to the required ultimate obtainable vacuum degree, for example, 1×10-6 Torr preliminarily evaporating the deposition material 2 by applying one half degree of normal input at evaporation, for example, about 5kVA input to the evaporation source 3. When preliminarily evaporated in the exhaust process after 2×10-6 Torr, a shutter 5 is closed and the shutter 5 is so operated as to be opened by making the applied input of evaporation source 3 a rated input, for example, about 10kVA when the ultimate vacuum degree is reached.
NISHIMURA SHIGERU
TANAKA KOUJI
TOMIOKA KOUZOU
MATSUBARA YOSHIO
SAITOU AKIO
