Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5834932
Kind Code:
A
Abstract:
PURPOSE:To reduce distortion produced in an element substrate by a method wherein a heat-resisting resin film is fixed by an adhesive agent between the element substrate and a support substrate therefor. CONSTITUTION:Thermosetting adhesive coatings 12 and 14, of an epoxy resin for example, are applied to the both surfaces of a heat-resisting film 13. The film 13 is then placed on a support substrate 11 and is overlaid with an element substrate 15, and the lamination is heated under pressure. The lamination solidifies, with the resin film 13 sandwiched between the element substrate 15 and the support substrate 11. Most of the stress generated between the two substrates 15 and 11 is absorbed by the resin film 13 and therefore little stress is expected to remain within the element substrate 15.
Inventors:
SAKURAI HISAHARU
Application Number:
JP13348081A
Publication Date:
March 01, 1983
Filing Date:
August 26, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/52; H01L21/58; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Takehiko Suzue