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Patent Searching and Data


Title:
HEAT-RESISTANT MOLDING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6031521
Kind Code:
A
Abstract:

PURPOSE: The titled composition having excellent heat resistance, heat insulation, and mechanical properties, especially slidability to soft metals, and good workability and moldability and useful as a sliding material, friction material, or the like, prepared by adding a specified composite filler to a specified thermosetting resin.

CONSTITUTION: The titled composition comprising 30W70wt% thermosetting resin essentially consisting of a polymaleimide of formula I , an aminophenol of formula II, and an epoxy compound having at least two epoxy groups on the molecule and 70W30wt% composite filler containing 50W83wt% fluorocarbon resin and 38W5wt% benzoguanamine/formaldehyde condensate. In the above formulas, R1 is an n-valent organic group, X1, X2, and R2 are each H, a halogen, or a monovalent organic group, n≥2, and m is 1W5. This composition has excellent heat resistance, heat insulation, and mechanical properties, especially slidability to soft metals such as Al and brass, and good workability and is useful as a sliding material, friction material, electrical insulating material, or the like.


Inventors:
OOKAWA TSUTOMU
MATSUDA ITSUO
Application Number:
JP13780683A
Publication Date:
February 18, 1985
Filing Date:
July 29, 1983
Export Citation:
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Assignee:
TOSHIBA CHEM PROD
International Classes:
C08L27/12; C08G59/00; C08G59/20; C08G59/28; C08G59/40; C08G73/00; C08G73/12; C08L1/00; C08L27/00; C08L61/26; C08L63/00; (IPC1-7): C08G59/20; C08G73/12; C08L27/12; C08L61/26; C08L63/00
Attorney, Agent or Firm:
Eiji Morota