Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5834944
Kind Code:
A
Abstract:
PURPOSE:To make the dividing line location accurate and easy by a method wherein the wiring metal layer is utilized in the semiconductor device as a dividing line of semiconductor device provided with several elements. CONSTITUTION:The metal 302 utilized in the element fetch electrode wiring forming process among the processes to complete a semiconductor on the dividing line 301, say Al is left as it is. Otherwise the alloy layer 302' comprising metal layer and semiconductor substrate is utilized as dividing line further otherwise the metal layer 402 may be coated with insulator 404. Through these procedures, the dividing line only may automatically locate the lines accurately without using the locating identification mark.
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Inventors:
KUSUSE NORIO
Application Number:
JP13351281A
Publication Date:
March 01, 1983
Filing Date:
August 26, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Uchihara Shin