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Patent Searching and Data


Title:
COATING METHOD OF SOLDER IN STAGE FOR ASSEMBLING CRYSTAL RESONATOR
Document Type and Number:
Japanese Patent JPS6117357
Kind Code:
A
Abstract:

PURPOSE: To coat extremely easily the fixed amt. of solder to the specified position of terminals by arranging the projecting parts of the terminals in a grid shape to a lower jig, joining a printed board having through-holes to the lower jig and packing the solder the through-holes.

CONSTITUTION: The plural terminals are set to a holder 7 and the plural holders 7 are set to the lower jig 14 to arrange the terminals 3 in the grid shape. Only the stem parts 5 of the terminals are positioned to the through-holes 16 of the printed board 15 when the board 15 is matched and joined atop the jig 14. The pasty solder 17 is coated atop the board 15 and the through-holes 16 are packed with the solder 17 by using a spatula 18. The excess solder 17 is removed. The soler 17 encloses fully the stems 5 into the elliptical shape of which the long axis is the lines connecting the stems 5 and stems 5 of the terminals into the range where the stems 5 exist approximately at the center of the arc of the elliptical shape when the board 15 is thereafter removed from the jig 14. The fixed amt. of the solder is thus coated to the terminals.


Inventors:
TAKAHASHI YOSHIHEI
Application Number:
JP13723184A
Publication Date:
January 25, 1986
Filing Date:
July 04, 1984
Export Citation:
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Assignee:
TAKAHASHI YOSHIHEI
International Classes:
H05K3/34; B23K3/06; B23K3/08; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Asamura Akira