Title:
COPPER ALLOY FOR MATERIAL OF LEAD OF SEMICONDUCTOR APPARATUS
Document Type and Number:
Japanese Patent JPS60145341
Kind Code:
A
Abstract:
PURPOSE: To obtain a Cu alloy for the material of the leads of a semiconductor apparatus having superior strength, superior heat resistance, satisfactory electric conductivity, high bendability and high adhesive strength to plating by adding specified amounts of Sn, Cr and P to Cu.
CONSTITUTION: The composition of a Cu alloy for the material of the leads of a semiconductor apparatus is composed of, by weight, 0.05W1% Sn, 0.05W1.2% Cr, 0.01W0.3% P and the balance Cu. Cu is melted in a graphite crucible, the surface of the molten metal is covered with charcoal powder, and after carrying out thorough melting, P, Cr and Sn are successively added so as to provided said composition. They are well agitated and cast into an ingot.
Inventors:
SHINOZAKI SHIGEO
AKASAKA KIICHI
IWAI HIROHISA
AKASAKA KIICHI
IWAI HIROHISA
Application Number:
JP174284A
Publication Date:
July 31, 1985
Filing Date:
January 09, 1984
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C22C9/00; C22C9/02; H01B1/02; (IPC1-7): C22C9/00
Domestic Patent References:
| JPS58123746A | 1983-07-23 |