PURPOSE: To improve the characteristics of electroless copper plating by immersing an article to be plated in an aqueous soln. contg. a complex compound prepd. by reacting a bivalent Pd compound or a uni- or bivalent Cu compound with glucose, pulling up the article, and heating it to produce metallic Pd or Cu.
CONSTITUTION: An article to be plated is immersed in an aqueous soln. of a complex compound prepd. by reacting a bivalent Pd compound or a uni- or bivalent Cu compound with glucose. The concn. of the complex compound in the aqueous soln. is ≤1wt% when the compound is expressed in terms of Pd or Cu. The article is pulled up from the soln., and it is heated to 30W200°C to form metallic Pd or Cu particles on the surface of the article. The article is then subjected to electroless copper plating by a conventional method.
YOKONO HARUKI
ISHIBASHI TAKEHIKO
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