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Patent Searching and Data


Title:
ROTARY MOLDING SYSTEM
Document Type and Number:
Japanese Patent JP3165491
Kind Code:
B2
Abstract:

PURPOSE: To uniformly carrying out heating of molds by constituting a heating station of a heating stage and a uniformly heating stage each having a temp. control means in a system wherein a plurality of molds for injection molding are heated at the heating station and are carried to an injection and filling station.
CONSTITUTION: A heating station for heating before a plurality of molds for injection molding are carried to an injection and filling station is constituted of the first heating stage, a uniformly heating stage and the second heating stage successively provided in the carrying direction. Set temp. of the first heating stage is set higher than that of a mold 11 at filling time and set temp. of the second heating stage is set at the same temp. as the temp. of the mold 11 at injection and filling time. In addition, a temp. adjusting means 21 facing by inserting the mold 11 consisting of a top mold 26 and a bottom mold 27 between them and having heater blocks 22-2S which are freely separated on the surface of the mold 11, is provided on each heating stage and the second temp. adjusting means utilizing the heater blocks 22-25 as heat insulation plates is provided on the uniformly heating stage.


Inventors:
Akira Fukushima
Hidenori Ito
Hisaaki Koseko
Toshiharu Hatakeyama
Kinichi Oikawa
Application Number:
JP251592A
Publication Date:
May 14, 2001
Filing Date:
January 10, 1992
Export Citation:
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Assignee:
株式会社リコー
リコー光学株式会社
International Classes:
B29C45/04; B29C45/17; B29C45/26; B29C45/73; B29C45/78; B29L11/00; (IPC1-7): B29C45/04
Domestic Patent References:
JP839642A
JP222811U
JP3112318U
Other References:
【文献】特許3103393(JP,B2)
Attorney, Agent or Firm:
Gunichiro Ariga