Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Tow prepreg, and a composite material pressure vessel and its manufacturing method
Document Type and Number:
Japanese Patent JP6020734
Kind Code:
B2
Abstract:
A tow prepreg, made by impregnating a reinforcing fiber bundle with a matrix resin composition that comprises component (A): epoxy resin, component (B): epoxy resin curing agent, and component (C'): pre-gelatinizing agent with a minimum viscosity temperature of 110°C or lower, wherein, the temperature of minimum viscosity is determined to be the temperature obtained at the minimum viscosity that appears on the highest temperature side when a sample is prepared by adding and dispersing homogeneously 10 parts by mass of the component (C') to 100 parts by mass of bisphenol-A epoxy resin with an epoxy equivalent weight of 190 ±6 g/eq, and by dissolving 10 parts by mass of a boron trichloride-octylamine complex into the mixture, and when the viscosity of the sample is measured by increasing the temperature at a rate of 2°C/min.

More Like This:
WO/2021/199906FIBER-REINFORCED RESIN, INTEGRATED MOLDED ARTICLE AND METHOD FOR PRODUCING FIBER-REINFORCED RESIN
JP6286807Prepreg, metal-clad laminate, printed wiring board
JP2692044[Title of Invention] Water Piston Pump
Inventors:
Satoshi Okamoto
Yukihiro Harada
Toru Kondo
Application Number:
JP2015535927A
Publication Date:
November 02, 2016
Filing Date:
June 30, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Mitsubishi Rayon Co., Ltd.
International Classes:
C08J5/24; C08G59/18
Domestic Patent References:
JPH10237196A1998-09-08
JPH0776658A1995-03-20
JP2015004020A2015-01-08
Foreign References:
WO2010090246A12010-08-12
WO2013183667A12013-12-12
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi



 
Previous Patent: A manufacturing method of a switching element, a semiconductor device, and a semiconductor device

Next Patent: JPS6020735