Title:
TRANSFER DEVICE AND TRANSFER METHOD FOR SOLDER BALL
Document Type and Number:
Japanese Patent JP3211613
Kind Code:
B2
Abstract:
PURPOSE: To provide a transfer device and transfer method for solder balls capable of surely vacuum sucking the solder balls by one piece each into a suction hole of a suction head and surely transferring the vacuum sucked solder balls on works at the time of vacuum sucking the solder balls into the suction hole and transferring the solder balls on the works.
CONSTITUTION: This transfer device has a positioning table A which positions the works 17, a ball reservoir B which houses the many solder balls 19, the suction head C which has the suction hole, picks up the solder balls 19 by vacuum sucking the balls from this ball reservoir B and transfers the solder balls 19 onto the works 17 by dropping the balls, a moving means D which moves the suction head C between the ball reservoir B and the works 17 and a vibrator 29 which applies vibration to the solder balls 19 held in the suction head C.
Inventors:
Tadahiko Sakai
Shoji Sakemi
Shoji Sakemi
Application Number:
JP5125295A
Publication Date:
September 25, 2001
Filing Date:
March 10, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P19/00; B23K3/06; H01L21/60; H05K3/34; H05K13/02; (IPC1-7): B23K3/06; H01L21/60; H05K3/34
Domestic Patent References:
| JP4368142A | ||||
| JP7226425A | ||||
| JP7153765A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)