Title:
Transfer mold sensor apparatus
Document Type and Number:
Japanese Patent JP5978170
Kind Code:
B2
Abstract:
To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.
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Inventors:
Akihiro Yaguchi
Masahide Hayashi
Kazunori Ota
Akihiro Okamoto
Masahide Hayashi
Kazunori Ota
Akihiro Okamoto
Application Number:
JP2013135738A
Publication Date:
August 24, 2016
Filing Date:
June 28, 2013
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
G01P15/08; G01C19/5783; H01L23/28; H01L25/065; H01L25/07; H01L25/18; H01L29/84
Domestic Patent References:
| JP5191915B2 |
Foreign References:
| US20090282917 |
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki
Yuji Toda
Shigemi Iwasaki