To provide an adhesive layer transfer tape in which cut performance of an adhesive layer is remarkably improved, compared with cut performance of a conventional adhesive layer transfer tape and to provide a transferring tool for adhesive layer transfer tapes which is sufficiently practicable even when the adhesive layer transfer tape is formed in a wide width of ≥11 mm.
In the adhesive layer transfer tape used in a state packed into the transferring tool for adhesive layer transfer tapes, the adhesive layer is obtained by successively laminating a first adhesive layer, a cut performance-improving layer and a second adhesive layer on a base material and the cut performance-improving layer is formed by a resin selected from a natural or synthetic rubber, an acrylic resin, an olefin resin, a silicone resin and a urethane resin.
COPYRIGHT: (C)2006,JPO&NCIPI
JP2006148096 | ADHESIVE TAPE FOR FIXING SEMICONDUCTOR WAFER |
JP2000073024 | TACKY SHEET |
JP2009202367 | ORNAMENTAL ADHESIVE SHEET |
JP11209710A | ||||
JP6172715A | ||||
JP2001240812A | ||||
JP5178525A | ||||
JP2003113353A | ||||
JP6346032A | ||||
JP8048951A | ||||
JP2001271041A | ||||
JP2001192625A | ||||
JP2004091769A | ||||
JP2003292932A | ||||
JP4069429U |