Title:
TRANSLUCENT CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2008149681
Kind Code:
A
Abstract:
To provide a translucent conductive material having a low surface resistance and can be used for a planar electrode or the like having excellent adhesion regardless of environmental conditions.
A translucent conductive substrate comprises a thinning pattern formed of a conductive metal containing developing silver and a transparent conductive layer on a support, and an easy adhesion layer having a swelling humidity ratio to water of less than 60% between the support and the thinning pattern.
Inventors:
SASAKI HIROTOMO
Application Number:
JP2006342828A
Publication Date:
July 03, 2008
Filing Date:
December 20, 2006
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
B32B15/08; B32B7/02; B32B9/00; B32B25/14; B32B27/00; B32B27/30; B32B27/36; B32B27/40; H01B5/14; H05B33/14; H05B33/28; H05K9/00
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa