Title:
封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
Document Type and Number:
Japanese Patent JP6300218
Kind Code:
B2
Abstract:
A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
Inventors:
Car suspension
Orchid
Golden Dragon Country
Kim Yu
Gold Haneul
Aji hedge
Orchid
Golden Dragon Country
Kim Yu
Gold Haneul
Aji hedge
Application Number:
JP2011289577A
Publication Date:
March 28, 2018
Filing Date:
December 28, 2011
Export Citation:
Assignee:
SAMSUNG SDI CO.,LTD.
International Classes:
C08L83/05; C08L83/07; H01L33/56; H01L51/50; H05B33/04
Domestic Patent References:
| JP2006519896A | ||||
| JP2012197409A | ||||
| JP2010001336A | ||||
| JP2010001335A | ||||
| JP2009091561A | ||||
| JP2000169714A | ||||
| JP10212413A | ||||
| JP2012052045A | ||||
| JP2007125785A1 |
Attorney, Agent or Firm:
Hatta International Patent Corporation