Title:
Transparent conductive film with a protection film
Document Type and Number:
Japanese Patent JP6227321
Kind Code:
B2
Abstract:
The invention provides a transparent conductive film with a protection film, which has excellent operability and can effectively inhibit generation of bending even when annealing treatment is implemented. The transparent conductive film with the protection film is formed by upwardly laminating a transparent conductive film, a first hard coating layer, a transparent plastic film substrate, a second hard coating layer and the protection film, the protection film is formed by an adhesion agent layer and a protection film substrate and can be laminated on the second hard coating layer in a stripping manner, hot-shrinkage rate of the transparent plastic film substrate in the MD direction when heated at 150 DEG C for 60 minutes is below 0.6%, and hot-shrinkage rate of the protection film substrate in the MD direction when heated at 150 DEG C for 60 minutes is below 0.6%.
Inventors:
Takuzo Watanabe
Keiichi Sato
Tomio Otsuka
Satoru Satoru
Keiichi Sato
Tomio Otsuka
Satoru Satoru
Application Number:
JP2013162003A
Publication Date:
November 08, 2017
Filing Date:
August 05, 2013
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B32B27/30; B32B27/00; G02B1/10; G02B1/11; H01B5/14
Domestic Patent References:
| JP2011253676A | ||||
| JP2004059860A | ||||
| JP2010032795A | ||||
| JP2013071380A | ||||
| JP2001332132A | ||||
| JP2002073282A | ||||
| JP2008251529A | ||||
| JP2013160954A |
Foreign References:
| US20040033735 |
Attorney, Agent or Firm:
Kenji Emori
Masakazu Yoshida
Masakazu Yoshida