To provide superior antistatic property and electromagnetic wave shielding property and further improve the antireflection property, mechanical characteristics and contamination preventing property by subjecting a transparent conductive metal fine particle layer, composed mainly of at least one kind of metal fine particles and formed on a base material, to water treatment and heat treatment.

This transparent conductive layer contains fine particles made of at least one metal. The average particle size of the metal fine particle is preferably 1-100 nm. The metal fine particle may be formed by means of vacuum evaporation, sputtering, ion plating, chemical evaporation or the like, but is preferably formed by applying a composition, containing the metal fine particle onto the base material. A solution mainly composed of water is preferably used to stabilize the dispersion in the formation of the applying solution of the metal fine particle. The heat treatment of the transparent conductive layer is preferably performed at 150°C or lower, although it may be varied, depending on the heat resistance of a plastic film. As the method of the heat treatment, the treatment is preferably performed, while passing the transparent conductive layer through a heating zone in a web state from the viewpoint of uniform treatment.