To provide a transparent film-like adhesive of excellent heat resistance (including cold resistance) and transparency, with an excellent bonding force.
This transparent film-like adhesive contains, as a main component, a polyimide resin containing, as main components, a BPDA unit derived from 3, 3', 4, 4'-biphenyl tetra-carboxylic dianhydride (BPDA), an acid dianhydride-derived unit containing at least a BPADA-derived unit derived from 2, 2-bis[4-(dicarboxyphenoxy)phenyl]propane acid dianhydride (BPADA), and a diamine-derived unit derived from at least one diamine selected from the group comprising 3, 3'-diamino diphenyl sulfone and bis[4-(3-aminopheoxy)phenyl]sulfone. The transparent film-like adhesive has a thermal fusing property to an object to be bonded.
IKENAGA TAMAKI
IKAI IEKO
